AgCu7.5 word as hoofsoldeermateriaal gebruik,AgCu25, AgCu28, AgCu55, ens., en die AgCu28 word wyd gebruik. Hulle het goeie geleidingsvermoë, vloeibaarheid en benatbaarheid, en word wyd gebruik in die elektriese vakuumbedryf. As gevolg van die lae weerstand teen langtermynlading onder hoë temperatuur, is dit slegs geskik vir die soldeer van onderdele waarvan die werktemperatuur laer as 400ºC is.
Gebruik as muntstukke en versierings. Die legerings wat as muntstukke gebruik word, is AgCu7.5, AgCu8,AgCu10, ens.; die legerings wat as versierings gebruik word, is AgCu8.4, AgCu12.5, ens.
Ag | Cu | Sn | Ni | Pb | Fe | Sb | Bi | |
AgCu4 | 96+/-0.3 | 4+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
AgCu5 | 95+/-0.3 | 5+0.3/-0.5 | ≤0.005 | ≤0.05 | ≤0.002 | ≤0.002 | ||
AgCu7.5 | 92.5+/-0.3 | 7.5+0.3/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
AgCu8.4 | 91.6+/-0.3 | 8.4+/-0.5 | ≤0.005 | ≤0.1 | ≤0.002 | ≤0.002 | ||
AgCu10 | 90+/-0.3 | 10+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu12.5 | 87.5+/-0.3 | 12.5+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu20 | 80+/-0.3 | 20+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu23 | 77+/-0.5 | 23+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu25 | 75+/-0.5 | 25+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu26 | 74+/-0.5 | 26+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu28 | 72+/-0.5 | 28+/-0.5 | ≤0.005 | ≤0.2 | ≤0.002 | ≤0.002 | ||
AgCu50 | 50+/-0.5 | 50+/-0.5 | ≤0.005 | ≤0.25 | ≤0.002 | ≤0.002 | ||
AgCu99 | 1+/-0.2 | 99+0.2/-0.5 | ||||||
AgCu18Ni2 | 80+/-0.5 | 18+/-0.5 | / | 2+/-0.3 |
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